The main draw of the NanoCOM-SKU is the CPU that powers the module. AAEON’s NanoCOM-SKU is the“first”COM Express Type 10 module to boost the 6th Gen Intel® Core™ CPU, a full fledged CPU, instead of a conventional SoCs. The Intel® Core™ i7-6600 chip used not only grants support for onboard DDR4 memory for increased computing power, but also unparalleled performance for a robust set of I/Os and capabilities, including PCIe, USB, SATA, as well as 4K-enabled eDP and Display Ports.
The construction of the onboard components, such as CPU and memory, is also notable with a fully-soldered design, protecting the module from shocks and vibrations. And it is also featured to support extended operating temperature range of -40~85°C for increased resilience in any industrial settings.
Given the enhanced funtionality and compactness of the module, it can be applied in a wide array of size-limited applications that demand reliability and mobility.
It is typical for compact COM-Express modules to carry SoCs rather than a normal CPU for its low power consuming attribute. But through AAEON's ingenuity, the NanoCOM-SKU undo the norm by mounting a full fledged CPU onto the merely 84 x 55mm of credit card sized board (while the typical 95 x 95 mm size by other contemporaries) to reach a performance level unrivalled by any similar products currently on the market.
The design of NanoCOM-SKU features 30% less components than other ordinary type of boards and more optimized circuitry that pushed more stability. Through this design, AAEON's NanoCOM-SKU even permits adoption of fanless thermal solutions, which could enable to reduce temperature and achieve "green", another feat not found in other contemporaries.
Also, the new chips grants support for the newer and faster DDR4, while DDR3-only supported by other similar products in the current market, empowering even more powerful capabilities in terms of speed, memory capacity, and higher power efficiency.
For its uniqueness both in powerful performance and compactness design, AAEON's NanaCOM-SKU prominently featured in 2016 IDF (Intel Developer Forum) in Shenzhen and SPS (Electric Automation Fair) in Italy.
在現今單板電腦普遍設計趨勢中，礙於高耗能及高度散熱需求的技術限制，效能高的處理器多半搭載於Size大的電腦主機板上，而效能低的處理器才能勉強設計於Size較小的主機板上，然而對於一向保持創新與挑戰不可能的研揚科技，則試圖打破此遊戲規則。研揚的研發團隊企圖將效能非常高的處理器，使用於尺寸小、甚至僅僅只有信用卡大小的模組化電腦中；研發團隊花了整整兩個月作線路優化的挑戰，除了消除不需要的線路、進一步作線路精簡化設計外，也努力研究測試高複合型的零件於電腦上，終於成功產出第一個原型產品並通過市面上標準高速信號規格的訊號測試，並於2016年4月獲Intel獨具慧眼於深圳IDF(Intel Developer Forum)上展出後，一炮而紅成為熱烈討論的話題。
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